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What are used as the solder materials of lead-free products?

Latest Updated:06/01/2007

Question:

What are used as the solder materials of lead-free products?

Answer:

The materials are classified as follows by pin processing.
External solder plating: Sn-Bi (tin-bismuth) or Sn (tin), Ni-Pd-Au (nickel-palladium-gold) (differs depending on the product)
External solder dip (Note): Sn-Ag-Cu (tin-sliver-copper)
Solder ball: Sn-Ag-Cu (tin-sliver-copper)

Note:
THD (Through Hole Device) type of discrete product (however, Sn-Bi for TO-251 (MP-3))

The other package materials are the same as lead solder products.

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